Failure Analysis, Materials Characterization and SEM Services
• Failure Analysis
• Materials Characterization
• Scanning Electron Microscopy (SEM) with Elemental Analysis (EDS)
• FTIR (Fourier Transform Infrared Spectroscopy) • EDS Analysis (Elemental Analysis)
• Optical Microscopy/Microphotography
• Metallographic Cross-Sectioning
• IC Decapsulation
• Electronic Component Design Evaluation
• Solder Analysis
• Printed Wiring Board (PWB) Procurement Support