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Materials Analysis Examples

A solderability issue in a flex circuit. Surface shows oxidized intermetallic compound.

Explosively bonded aluminum-steel material. (Sample courtesy of High Energy Metals (www.highenergymetals.com), Sequim, WA)

Solder failure analysis. BGA failure due to organic particles on solder bumps. These were also found included in solder joints on finished assemblies.

Pb-dendrite formed by electromigration on the surface of the flux residue.

Paper products - potassium chloride particle contaminant on printer paper.

Fatigue striations on fracture surface of stainless steel spring.

Corrosion problem causing gold plating to flake off.

Eutectic Pb-Sn microstructure with Au-Sn intermetallic compound on surface of a BGA solder bump.